2024 Semiconductor Equipment Solution: Ultra-Precision Wafer Inspection Platform Base

Project Type: Product R&D
Execution Period: 2024
Core Materials: Bozhida Mineral Castings + Carbon Fiber Beams

Solution Background

As semiconductor processes advance toward 3nm and below nodes, wafer inspection equipment demands near-demanding requirements for mechanical structure static stiffness, dynamic damping, and thermal stability. Traditional cast iron or steel bases are prone to micro-vibrations during high-speed motion, with uncontrollable thermal deformation becoming a bottleneck limiting inspection accuracy. In 2024, Bozhida addressed this challenge by introducing a next-generation “Mineral Castings + Carbon Fiber” composite structural solution.

Technical Core

This solution employs Bozhida's high-performance mineral castings as the main base, integrated with high-modulus carbon fiber composite beams. Mineral castings offer superior vibration absorption, with damping properties exceeding cast iron by over 10 times, effectively absorbing high-frequency vibrations generated by motor movement. Carbon fiber beams, leveraging their lightweight and high-rigidity characteristics, significantly reduce motion inertia. Integrated through patented connection technology, this combination achieves a perfect balance between stability and speed.

Flagship Case: Han's Laser Wafer Inspection Equipment

As the core equipment base supplier for Han's Laser, Bozhida jointly developed a next-generation wafer appearance inspection machine with them in 2024. In this project, Bozhida's composite base solution delivered outstanding performance:
•  Precision Enhancement: Equipment repeat positioning accuracy improved from conventional 1.5μm to within 0.3μm, meeting high-end wafer micro-defect detection requirements.
•  Efficiency Optimization: Thanks to the lightweight carbon fiber crossbeam, scanning axis acceleration increased by 40%, significantly boosting overall machine throughput (UPH).
•  Thermal Stability: During continuous 24-hour operation testing, base thermal deformation was controlled below 1μm/m, eliminating frequent recalibration.
This collaborative achievement has translated into tangible productivity gains and secured a national invention patent (Patent No.: ZL2023 2 XXXXXXXX.X) for “A High-Damping Mineral Casting and Carbon Fiber Connection Structure,” establishing a robust technological moat.

Customer Value

BoZhida's solution not only resolves equipment vibration and deformation challenges but also accelerates clients' R&D cycles. Through integrated casting and pre-embedding technology, secondary processing steps are minimized, reducing overall manufacturing costs.

Conclusion

Targeting the global semiconductor market, Bozhida will continue to deepen its expertise in ultra-precision material applications. We look forward to collaborating with international equipment manufacturers to empower semiconductor equipment with innovative material technologies, jointly advancing chip manufacturing precision and efficiency to new heights.